Work

Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling

Year: 2026

Type: article

Abstract: Tin-based solder joints are widely used to provide high-density interconnection in microelectronic packaging. Experiments show that under repetitive temperature cycling, subgrains may nucleate in the tin phase, contributing to early degradation. We present numerical simulations on a board-level packaging stack-up during cool-down and under thermal cycling. A crystal plasticity model and thermomechanical anisotropy are utilized to study the deformation of the solder joints. With this model, we can quantify the contributions to the deformation from the joint location versus the result of thermoelastic anisotropy during thermal cycling.

Source: Journal of Electronic Materials

DOI: 10.1007/s11664-026-12756-7

Authors: Kai-chieh Chiang, Marisol Koslowski

Institution: Purdue University West Lafayette

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: hybrid

Estimated APC paid: $3,390

Funders: Semiconductor Research Corporation, Nokia