Work

Machine Learning-Based Co-Design of Advanced Flip-Chip Packages: Co-Optimization of Package Warpage, Die Stress, Solder-Joint Reliability, Thermal Management, and Signal Integrity

Year: 2026

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2026.3674462

Authors: Mohammad Rafiee, Maryam Hasheminasab, Farough Agin, Farah El Siss

Institutions: University of Ottawa, Sanmina (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7136258151

FWCI: 7.563

Cites: 19

Cited by: 5

Related to: 10