Work

A Failure Diagnosis Method for Multichip IGBT Modules Using a Novel Chip Failure Sensitive Parameter

Year: 2026

Type: article

Source: International Journal of Circuit Theory and Applications

DOI: 10.1002/cta.70391

Authors: Mingxing Du, Chudong Tang, Jianxiong Yang, Jinliang Yin

Institution: Tianjin University of Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Key Research and Development Program of China

Award: G488700572

OpenAlex ID: W7136607992

FWCI:

Cites: 27

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