Strain‐Engineered Gradient‐Modulus Platforms for Mechanically Robust and Conformable Hybrid Electronics
Year: 2026
Type: article
Source: Advanced Functional Materials
DOI: 10.1002/adfm.75046
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7140081566
