Work

Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorithm

Year: 2026

Type: article

Source: Microelectronics International

DOI: 10.1108/mi-07-2025-0130

Authors: Xianjia Liu, Long Huang, Chunyue Huang, Yonglin Chen, Ying Liang, Chao Gao, Liye Wu, Zhiqin Cao

Institutions: Guilin University of Electronic Technology, Panzhihua University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G4868524918

OpenAlex ID: W7140113872

FWCI:

Cites: 2

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