Investigation of thermal conductivity of monolayer MoS2 supported on PDMS substrates with varying adhesion under different tensile strains
Year: 2026
Type: article
Abstract: Atomically thin molybdenum disulfide (MoS2) has emerged as a promising candidate for next-generation flexible electronic devices due to its exceptional physical properties. However, in practical applications, a degree of interfacial sliding occurs between the flexible substrate and the two-dimensional (2D) material, which significantly impacts thermal transport properties of the materials. In this work, we prepared three types of polydimethylsiloxane (PDMS) substrates with varying adhesion by adjusting the mixing ratios of pre-polymer and curing agent (10:1, 15:1, and 20:1) and subsequently investigated the thermal conductivity of monolayer MoS2 supported on different PDMS substrates under uniaxial tensile strains from 0% to 6% via the optothermal Raman technique. Our results demonstrate a decreasing trend in the thermal conductivity of MoS2 with increasing tensile strain. In addition, we found that at a 6% substrate strain, the thermal conductivity of MoS2 on high-adhesion (20:1) and low-adhesion (10:1) PDMS substrates decreased to 28.2 ± 5.5 W/(m K) and 43.4 ± 6.1 W/(m K), respectively, marking reductions of 52% and 33% from their respective 0% strain values [58.5 ± 14 W/(m K) and 64.5 ± 12.8 W/(m K)]. This work reveals the influence mechanism of flexible substrates with different adhesion on the measurement of 2D material thermal properties, providing a scientific basis for the thermal management design of flexible electronic devices in high-strain environments.
Source: Journal of Applied Physics
DOI: 10.1063/5.0320455
Authors: Wenlong Cheng, Ke Tang, Zhuoliang Zan, Xiang Ben, Kedong Bi
Institution: Southeast University
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $3,500
Awards: G1675760529, G6949902395
OpenAlex ID: W7140118872