Work

Impedance Optimization of the Power Distribution Network in a Three-Dimensional Microassembly with Back Side Commutation

Year: 2025

Type: article

Source: Russian Microelectronics

DOI: 10.1134/s1063739725601389

Authors: S. A. Batin, S. P. Semenov, D. V. Vertyanov, S. P. Timoshenkov

Institution: National Research University of Electronic Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W7140133769

FWCI:

Cites: 5

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