Work

Deposition and Etching of Ruthenium for Promising Metallization Systems of Integrated Circuits

Year: 2025

Type: article

Source: Russian Microelectronics

DOI: 10.1134/s106373972560222x

Authors: A. V. Miakonkikh, V. O. Kuzmenko, A. E. Rogozhin

Institutions: MIREA - Russian Technological University, Moscow Power Engineering Institute

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7140136499

FWCI: 0.163

Cites: 15

Cited by: 1

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