Work

Thermal‐Aware Modeling of Mean Free Path and RLC Per‐Unit‐Length Parameters for Borophene On‐Chip Interconnects

Year: 2026

Type: article

Source: physica status solidi (a)

DOI: 10.1002/pssa.202500875

Authors: Vinod Agarawal, Somesh Kumar

Institution: Atal Bihari Vajpayee Indian Institute of Information Technology and Management

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7140145694

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Cites: 34

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