Work

Investigation of Microstructure, Electrical and Mechanical Properties of Zn-Mg-Sn High-Temperature Lead-Free Solder Alloy

Year: 2026

Type: article

Source: MATERIALS TRANSACTIONS

DOI: 10.2320/matertrans.mt-m2025133

Authors: Canan Alper Billur, Buket Saatçi, Fehmi Nair, Mehmet Arı

Institutions: Sivas Cumhuriyet Üniversitesi, Erciyes University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7140200362

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Cites: 33

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