In-situ tools, sample designs and protocols (D3.2)
Year: 2025
Type: article
Abstract: A new in-situ set-up for thermal cycling of copper on silicon (polyheater) samples has been established at IKTS. An exemplary sample was imaged using X-ray transmission imaging, validating the set-up functionality. New sample layouts for 3D imaging were designed and produced at Infineon Technologies Austria and KAI, but could not yet be imaged due to production delays.
Author: Neumann, Laura
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
Funder: European Commission
OpenAlex ID: W7140758156
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