Fast Analysis of Multilayer Micro-Machined Coupler Based on Mode-Matching Method
Year: 2026
Type: article
Abstract: The development of next-generation terahertz (THz) transmitters and receivers based on 3D stacked packaging technology relies heavily on the integration of high-performance waveguide directional couplers. This paper presents an accurate and efficient method based on the mode-matching method (MMM) for the rapid analysis of a branch waveguide coupler fabricated through a silicon-based 3D stacking process. In contrast to the traditional method using the finite-element method (FEM) in HFSS, which is cumbersome and time-consuming, the proposed method offers orders-of-magnitude speed improvement. It is especially well-suited for large-scale uncertainty error analysis and statistical evaluation of THz waveguide couplers and related components. This theoretical MMM is validated through an experiment by characterizing a deep reactive ion etching (DRIE) fabricated and 3D stacked 220 GHz waveguide coupler.
Source: Micromachines
DOI: 10.3390/mi17040412
Authors: Sheng Li, Yun Zhao, Hao Gu, Shisheng Yang, Zhongbo Zhu, Chongdi Duan, Tingting Wang, Shengxiao Jin, Caixia Wang, Wei Shao, Jiangqiao Ding
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,534
Awards: G3678841051, G4000215884, G4023013306
OpenAlex ID: W7141511846