Advances in the Reduction of the Warpage for Flip Chip Packages
Year: 2026
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4071536
Authors: Guoqi Zhu, Lei Han, Xiaoxiao Zheng, Yu Sun, Xiangli Qin, Xinyu Song, Hao Tang, Xiaoqing Jiang, Jie Li, Yafei Ning, Hu Li
Institution: Shandong University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G8750146009
OpenAlex ID: W7141590331