Effect of Bending Deformation on Damage of Ag Nanoparticle Lines Under Electrical Loading
Year: 2026
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4071537
Institution: Hirosaki University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G5026229748
OpenAlex ID: W7141713489
