Advanced Thermal Management Systems for High-Performance Electronics
Year: 2020
Type: article
Abstract: The increasing demand for high-performance electronics, particularly in industries such as aerospace, automotive, and consumer electronics, has led to a significant rise in the power density of electronic systems. As a result, managing heat dissipation in these systems has become a critical challenge. This article discusses advanced thermal management technologies that have been developed to address the challenges associated with high-power density systems. Key strategies such as microchannel heat sinks, phase-change materials (PCMs), and thermoelectric cooling are explored, along with their advantages and limitations. A comprehensive analysis of material selection, design optimization, and system integration for efficient thermal management is provided. The article also highlights future trends in cooling technologies, focusing on their potential applications in next-generation high-performance electronics.
DOI: 10.71465/ajmet1968
Author: Dr. Alex Williams
Institution: University of California, Berkeley
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W7141816910