Work

Structure–property interplay in Cu 6 Te 3− x S 1+ x : an analytical approach to thermoelectric optimization

Year: 2026

Type: article

Abstract: In this contribution, we present an analytical interpretation of structure-property relationships in the Cu₆Te₃₋ₓS₁₊ₓ chalcogenide system, based on experimental transport data and classical physical models.We show in our previous work [1] that progressive substitution of Te by S leads to a substantial increase in the electronic band gap (from ~0.07 eV at x = 0 to ~0.2 eV at x = 0.7), which correlates with a strong enhancement of the Seebeck coefficient (from ~9 μV/K to ~200 μV/K) and a more than 40-fold decrease in electrical conductivity (from ~3600 S/cm to ~85 S/cm at 298 K).

Source: Acta Crystallographica Section A Foundations and Advances

DOI: 10.1107/s2053273325099371

Authors: K. T. Wojciechowski, O. Cherniushok, T. Parashchuk, Y. Tokaychuk

Institutions: AGH University of Krakow, Lviv University

Language: English

Topic: Advanced Thermoelectric Materials and Devices

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: bronze

Funders: National Science Foundation, Narodowa Agencja Wymiany Akademickiej

Award: G8306413105