Work

The relationship between adhesion and microstructure of copper films obtained in different plasma deposition modes

Year: 2026

Type: article

Source: Low Temperature Physics

DOI: 10.1063/10.0043159

Authors: S. Dukarov, M. Fijalkowski, S. Petrushenko, M. Šetina, V. Sukhov

Institutions: V. N. Karazin Kharkiv National University, Technical University of Liberec

Language: English

Topic: Metal and Thin Film Mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7147048567

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Cites: 41

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