Year: 2026
Type: article
Abstract: Solution-processed electronics based on two-dimensional materials rely on the deposition of high-quality nanosheet networks to produce high-performance devices, but creating devices with performance approaching the intrinsic limits of the 2D material requires structures that resemble bulk crystal conditions. This Perspective compares two assembly techniques that have achieved this by decoupling in-plane packing and out-of-plane stacking: spin coating and liquid-interface deposition. By outlining their respective strengths and limitations, we provide an overview on selecting appropriate deposition strategies to advance high-performance large-area electronics.
Authors: Joseph Neilson, Adam G. Kelly
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $3,405
Award: G6920853067
OpenAlex ID: W7147159136
