First Flexible All‐Perovskite Tandem Minimodule Using Au‐Free Recombination Junction
Year: 2026
Type: article
Abstract: All‐perovskite tandem devices are widely studied, as they ensure to overcome the limitations of single‐junction devices. However, scaling up the technology into modules on the flexible substrates is a key challenge for commercialization. In this work, strategies are combined to fabricate monolithic 2‐terminal all‐perovskite tandem (M2TAPT) minimodules on flexible substrates. A methylammonium (MA, CH 3 NH 3 + )‐free perovskite formulation leading to a bandgap ( E g ) of 1.73 eV is selected and successfully deposited on the flexible substrate. In order to avoid shunts at the interconnections in modules, a thin indium tin oxide recombination layer with high lateral resistivity is developed by DC sputtering. The solvent‐barrier property is assisted by a uniform and dense tin oxide (SnO 2 ) buffer layer grown by atomic layer deposition. Regarding the interconnections of the cells, an appropriate laser scribing process is established in order to achieve a selective and clean removal without affecting the tandem stack. Finally, M2TAPT minimodules are successfully developed on flexible substrates with a geometrical fill factor of 93.8%. A power conversion efficiency of 15.9% is achieved on an active area of 11 cm 2 with a steady‐state efficiency of 15.2% measured after one week of dark storage in the glovebox.
Source: Advanced Photonics Research
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $3,070
OpenAlex ID: W7148485894