Work

Atomic Bridge‐Bond Engineering for Interfacial Thermal Transport Optimizing in Borophene Lateral Heterostructures

Year: 2026

Type: article

Source: Advanced Functional Materials

DOI: 10.1002/adfm.202531954

Authors: Jingchao Zhang, Zhiping Li, Shichang Li, Yu Liu, Zhongwei Zhang, Dengfeng Li

Institutions: Chongqing University of Posts and Telecommunications, Tongji University

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G5385189916

OpenAlex ID: W7148502602

FWCI: 2.893

Cites: 56

Cited by: 2

Related to: