Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review
Year: 2026
Type: article
Source: Microelectronics International
Authors: Chong Leong Gan, Min-Hua Chung, Chen-Yu Huang
Institution: Micron (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7150923509