Recent Advances in the Investigation of Chemical Mechanical Polishing (CMP) Material Removal Mechanisms in Integrated Circuit Fabrication
Year: 2026
Type: article
Source: Chinese Rare Earths
Authors: Na FAN, Zhong-yi ZHANG, Qun HU, Chuan-dong CHEN, Si-yuan ZHAO, Shuai-jun YUE, Yang LIU, Yan-ying CUI, Xiao-pei LI
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7154167090
FWCI:
Cites:
Cited by:
Related to: