Reliability of Ni-modified reduced graphene oxide reinforced Sn-58Bi/Cu solder joints after isothermal aging
Year: 2026
Type: article
Abstract: The Joule heat generated during the opreation of microelectronic devices can subject the Sn-Bi solder alloy to isothermal aging, which affects the reliability of solder joint interconnections. In this study, the effect of nickel-modified reduced graphene oxide (rGO@Ni) on the microstructure and shear fracture behaviour of Cu/Sn-58Bi-rGO@Ni/Cu solder joints was investigated. The solder joints were reflowed at 160 °C to 180 °C for 80 s, followed by isothermal aging at 100 °C for different time. The crystal structure of the solder was analysed by electron backscatter diffraction. The morphology of the solder joints was observed by scanning electron microscopy. The results showed that the growth rate of the IMC layer in the Sn-58Bi-0.01rGO@Ni solder is the slowest. The addition of 0.01 wt% rGO@Ni reduces the risk of brittle Bi phase and enhances the shear strength of the solder joints.
Source: Materials & Design
Institutions: Guangxi University, Baise University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $3,650
Awards: G2016002, G333480503, G4947357732, G7340129118
OpenAlex ID: W7155170194