Optoelectronic co-simulation model for a 3D integrated structure with TSVs based on a micro-ring modulator and driver
Year: 2026
Type: article
Source: Applied Optics
DOI: 10.1364/ao.592624
Authors: Dehua Dai, Shuxiao Wang, Yunfei Zhang, Jingyu Wei, Huanwen Zhang, Jingbo Shi, Yan Cai
Institution: Beijing University of Posts and Telecommunications
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G5640326672, G8472499195, G982443954
OpenAlex ID: W7155220011