Dual‐Anchored Interfacial Adhesion‐Enhanced Strain‐Insensitive Hydrogels Electronic Skin for Consciousness‐Driven Brain‐Computer Interface
Year: 2026
Type: article
Source: Advanced Functional Materials
Institution: Northeastern University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7155648137
