Application of Laser Assisted Soldering for Replacing Massive Reflow in Solder Ball Mounting Process
Year: 2026
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4071751
Authors: Jong-Chan Park, Chung-Lyul Ahn, Tae-Keun Lee
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7155841845