Work

Simulation study on the electro-thermo-mechanical effects of nano-silver solder layer and voids on press-pack IGBT

Year: 2026

Type: conference-paper

Source: IET conference proceedings.

DOI: 10.1049/icp.2026.0657

Authors: Guowei Zhou, Junhua Hu, Xiaodong Li

Institutions: State Grid Corporation of China (China), State Grid Zhejiang Electric Power Company (China), North China Electric Power University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W7160437812

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