Work

Correction: Sharma et al. Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring. Metals 2021, 11, 1537

Year: 2026

Type: erratum

Abstract: There were some errors in the original publication [...]

Source: Metals

DOI: 10.3390/met16050506

Authors: Vinamra Bhushan Sharma, Saurabh Tewari, Susham Biswas, Bharat Lohani, Umakant Dhar Dwivedi, Deepak Dwivedi, Ashutosh Sharma, Jae Pil Jung

Institutions: Rajiv Gandhi Institute of Petroleum Technology, Indian Institute of Technology Kanpur, Ajou University, University of Seoul

Language: English

Topic: Structural Health Monitoring Techniques

Subfield: Civil and Structural Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: gold

Estimated APC paid: $3,137

OpenAlex ID: W7160607507

Cites: 1

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