Work

Polyurethane-Modified Acrylic Resins: High-Adhesion and Low-Dielectric Solder Resists for Advanced Packaging

Year: 2026

Type: article

Source: ACS Applied Polymer Materials

DOI: 10.1021/acsapm.6c01131

Authors: Jialin Zhang, Chuanyu Wu, Jie Liu, Shuye Zhang, Tao Wang, Xialei Lv, Jinhui Li, Guoping Zhang, Rong Sun

Institutions: Chinese Academy of Sciences, Harbin Institute of Technology, Shenzhen Institutes of Advanced Technology, Shenzhen Institute of Advanced Electronic Materials, Southern University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Heilongjiang Province, Shenzhen Fundamental Research Program, Special Project for Research and Development in Key areas of Guangdong Province, Shenzhen Science and Technology Innovation Program, Basic and Applied Basic Research Foundation of Guangdong Province, Shenzhen Institutes of Advanced Technology Innovation Program for Excellent Young Researchers

Awards: G2145918774, G2742324222, G286847963, G4396152937, G4475204821, G4529848207, G6882749538, G6930384791, G6935520047, G7766220979, G8979790326

OpenAlex ID: W7160643236

FWCI:

Cites: 37

Cited by:

Related to: