Effect of Ni Addition on the Comprehensive Properties of Bi–2.6Ag– x Ni/Cu Solder Joints
Year: 2026
Type: article
Source: Advanced Engineering Materials
DOI: 10.1002/adem.70908
Authors: Xuemei Li, Yupeng Su, Mingyu Qi, Rui Guo, Rui Fan, Hongyan Wang, Li Bao
Institution: Qiqihar University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G1166506661
OpenAlex ID: W7160707563