Work

Low-temperature hybrid bonding using sequential ArH2 and ArH2N2 low-inductance antenna plasma-assisted activation

Year: 2026

Type: article

Source: Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena

DOI: 10.1116/6.0005409

Authors: Hideki Shimizu, Hiroshi Nishikawa, Koji Hashimoto

Institutions: SCREEN (Japan), The University of Osaka

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: New Energy and Industrial Technology Development Organization

Award: G3633360255

OpenAlex ID: W7160832385

FWCI:

Cites: 28

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