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Atomic-Level Surface of Copper Induced by Photocatalytic Chemical Mechanical Polishing with High Material Removal Rate under Visible Light Irradiation

Year: 2026

Type: article

Source: ACS Applied Electronic Materials

DOI: 10.1021/acsaelm.6c00531

Authors: Jinyuan Tian, Zhenyu Zhang, Yize Sun, Guanglin Zhang, Xia Ji, Yujie Chen, Ming Zhang, Kun Shan, Qing Zhang

Institutions: Donghua University, East China University of Science and Technology, China Academy of Space Technology, Beijing Institute of Control Engineering

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Government of Jiangsu Province, Science and Technology Commission of Shanghai Municipality, Fundamental Research Funds for the Central Universities

Awards: G209082371, G5930720675, G7560254078

OpenAlex ID: W7160867674

FWCI:

Cites: 66

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