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AI-Driven cross-scale modeling for SiP thermo-mechanical simulation

Year: 2026

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-03-2026-0017

Authors: Ce Zeng, Yanming Zhang, Mingqi Gao, Can Sheng, Dongyang Lei, Yang Li, Yangyang Li, Zhenduo Cui, Shengli Zhu

Institutions: Tianjin University, China Electronics Technology Group Corporation, University of Electronic Science and Technology of China

Language: English

Topic: Composite Material Mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W7161594037

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Cites: 31

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