Work

Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends

Year: 2026

Type: article

Source: ACS Applied Materials & Interfaces

DOI: 10.1021/acsami.6c04556

Authors: Xianlian Lin, Jiali Wang, Shuhao Cai, Yongjiang Wang, Zhenguo Liu

Institutions: Northwestern Polytechnical University, Henan University, Luoyang Ship Material Research Institute

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Major Scientific and Technological Project of Zhejiang Province

Award: G984800795

OpenAlex ID: W7161624893

FWCI: 3.578

Cites: 149

Cited by: 2

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