Challenges in Co-Packaging of Si–III/V Components in Silicon Photonics
Year: 2026
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4071960
Institution: The University of Texas at Arlington
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7161631313