Work

Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects

Year: 2026

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-11-2025-0059

Authors: Fan Ju, Jie Pu, Yuebing Wang, Cheng Yang, Feihu Dai, Yong Ji, Chengqian Wang

Institution: China Electronics Technology Group Corporation

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7162122184

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Cites: 7

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