Work

Optimization of Plasma Etching Process for 25:1 High Aspect Ratio Through‐Silicon Vias

Year: 2026

Type: article

Source: Contributions to Plasma Physics

DOI: 10.1002/ctpp.70140

Authors: Mingze Li, Shizheng Li, Jiaming Zeng, Jiahui Huang, Yuxuan Li, Cui Liu

Institutions: East China University of Science and Technology, Advanced Micro-Fabrication Equipment (China)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7162773432

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Cites: 28

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