Prediction and Optimization of Copper Inverse Opal Wick for Enhanced Capillary-Fed Evaporative Cooling
Year: 2026
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4072064
Authors: Shangyang Shi, Jianyu Du, Wei Wang, Chi Zhang
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G5033601021
OpenAlex ID: W7162790727
