Thermal Management in Electronics: From Conventional Cooling to Hybrid Innovations
Year: 2026
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4072063
Authors: Bijaya Raj Karki, Aayush Luitel
Institutions: Tribhuvan University, SRM Institute of Science and Technology
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7162808090