Work

Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications

Year: 2026

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-01-2026-0006

Authors: Ye Tian, Haojie Chen, Lushan Ma, Chao Wang, Ziqiang Li, Lei Ma, Yongfeng Dong, Xing Chen

Institution: Henan University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W7162809590

FWCI: 1.692

Cites: 67

Cited by: 1

Related to: