Work

Thermal Cycling Reprograms Solution Aggregation and Strain‐Tolerant Charge Transport in Polymer Blends for Stretchable Electronic Films

Year: 2026

Type: article

Source: Advanced Functional Materials

DOI: 10.1002/adfm.76525

Authors: Mengqi Yu, Chunlong Sun, Mengyuan Gao, Junjiang Wu, Long Ye

Institutions: Tianjin University, Collaborative Innovation Center of Chemical Science and Engineering Tianjin, Taiyuan University of Technology

Language: English

Topic: Organic Electronics and Photovoltaics

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G7884887684

OpenAlex ID: W7164907142

FWCI: 3.531

Cites: 44

Cited by: 2

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