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AlN-based Chiplet Encapsulation: Enhancing Thermal Performance for High-density Heterogeneous Integration

Year: 2026

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51846.2026.00065

Authors: Ashita Victor, Dohyun Go, Hansol Lee, Diego Contreras Mora, Andrew C. Kummel, Muhannad S. Bakir

Institutions: Georgia Institute of Technology, University of California San Diego

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W7165023331

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Cites: 9

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