Coupled Electronic and Ionic Conductivity in Strain‐Stiffening Hydrogels
Year: 2026
Type: article
Abstract: ABSTRACT Advanced bioelectronics require soft materials that mechanically mimic tissues by exhibiting nonlinear mechanics and seamlessly bridge ionic signals in tissues and electronic signals in circuits. Creating conductive hydrogels with percolative electronic pathways that show tissue‐mimetic strain‐stiffening behavior represents a promising strategy to potentially address this need. Here, we report a composite hydrogel of poly(vinyl alcohol) (PVA) and poly(aniline boronic acid) (PABA) that exhibits strain‐stiffening mechanical behavior with mixed ionic and electronic conduction. Dynamic self‐healing boronic‐ester crosslinks that impart strain‐stiffening also facilitate the formation of a percolative network of conjugated conductive polymers during gelation, providing a continuous pathway for electronic transport ( σ e ∼ 10 −5 –10 −3 S m −1 ) alongside ionic conductivity ( σ i ∼ 1–10 S m −1 ). As a result, deformation directly modulates the electronic resistance, displaying a distinct resistance‐stabilization plateau that coincides with the onset of strain‐stiffening, suggesting a transition from geometry‐limited to alignment‐assisted charge transport within the network. By unifying adaptive tissue‐like mechanics with dual conduction, this system offers a promising avenue for developing soft, mechanically resilient materials capable of continuous electromechanical transduction.
Source: Advanced Science
DOI: 10.1002/advs.76247
Authors: Md Al Raihan, Mark M. A. Mikhail, Khaled M. Hijazi, Hessameddin Yaghoobi, John P. Frampton, Vahid Adibnia, Michael S. Freund
Institution: Dalhousie University
Language: English
Subfield: Polymers and Plastics
Field: Materials Science
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $6,730
Awards: G1335640904, Conjugated Polymers and Composites for Energy, Electronics and Sensing, Sustainable design of polymeric biomaterials for biolubrication, bioadhesion and antifouling applications: From the intermolecular interactions to the bulk properties, Multiscale Assembly of Soft Biomaterials, G5680046654, G7532718733, Integrated Circuits for Next-Generation Neural Implants
OpenAlex ID: W7165908188
