Transient Thermal Response of Banana–Bagasse Fiber Hybrid Biocomposite Plates with Conch Shell Filler Using Active Infrared Thermography
Year: 2026
Type: article
Abstract: The transient heat-transfer behavior of hybrid natural-fiber-reinforced epoxy composites containing 0–5 wt% conch shell filler and 20–35 wt% combined banana–bagasse fiber reinforcement was evaluated using active infrared thermography. A standardized protocol comprising 30 s of convective heating with 100 °C hot air followed by 60 s of natural cooling was applied to seven composite configurations tested in triplicate. The transient response was analyzed in three phases: active heating (0–30 s), thermal lag (30–57 s), and natural cooling (57–90 s). Maximum temperature (Tmax), heating rate (Rh), cooling rate (Rc), and a thermal retention ratio (TR) were extracted and statistically validated by one-way ANOVA with Bonferroni correction. For specimens exhibiting zero within-group variance at the camera display resolution, significance was confirmed using exact permutation tests. Filler incorporation (3–5 wt%) was the dominant factor governing peak-temperature reduction; F5B15S10 (5 wt% filler, 25 wt% total fiber) achieved the lowest Tmax (33.80 °C, 4.57 °C below neat epoxy). Cooling efficiency was primarily governed by fiber content; F3B15S20 (3 wt% filler, 35 wt% total fiber) demonstrated the most efficient heat dissipation (TR=0.721). These findings demonstrate that heating resistance and cooling efficiency are governed by partially independent mechanisms, enabling tailored material design. This study indicates that the proposed transient thermographic protocol provides a valuable reference to thermal management design of hybrid biocomposites in automotive interior and building envelope applications.
Source: Journal of Composites Science
DOI: 10.3390/jcs10070333
Language: English
Subfield: Polymers and Plastics
Field: Materials Science
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,172
Awards: G3794511424, G385462890
OpenAlex ID: W7165921887
