An Ultra-Strength, Low-Temperature-Curing Adhesive Enabled by a Polyphenol-Enhanced Phase-Separation Network
Year: 2026
Type: article
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Awards: G1389390102, G672896372
OpenAlex ID: W7166561172
