Work

Through-silicon via etch uniformity enhancement and aspect-ratio influence on etch rate and profile

Year: 2026

Type: article

Source: Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena

DOI: 10.1116/6.0005567

Authors: Chaewon Jeong, Violeta Georgieva, Jeongsoo Kim, Jaekyun Kim, Katia Devriendt

Institutions: Hanyang University, IMEC

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National NanoFab Center

Award: G8840051105

OpenAlex ID: W7167035588

FWCI:

Cites: 39

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