Microstructural evolution, wear resistance, and electrical conductivity of Cu–Ti₂SnC functionally graded composites fabricated by cryogenic deformation-driven metallurgy
Year: 2026
Type: article
Source: Canadian Metallurgical Quarterly
Author: Hamed Jamshidi Aval
Institution: Babol Noshirvani University of Technology
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W7168959334