Work

Preparation of Copper‐Supported Hexagonal Boron Nitride Polydimethylsiloxane Thermal Conductive Gasket

Year: 2026

Type: article

Source: Journal of Applied Polymer Science

DOI: 10.1002/app.71072

Authors: Yuanzhi Liu, Xiaoming Wang, Ling Weng, Yingtang Zhang, Hao Wu

Institutions: Harbin University of Science and Technology, Henan Institute of Technology

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: Natural Science Foundation of Heilongjiang Province, Natural Science Foundation of Henan Province

Awards: G1558989651, G756753555

OpenAlex ID: W7169506512

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Cites: 37

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