Work

Profile evolution and mechanisms in pulsed-bias plasma etching of high-aspect-ratio silicon pillars for wafer-scale metasurface manufacturing

Year: 2026

Type: article

Source: Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

DOI: 10.1116/6.0005573

Authors: Jianming Guo, Zhengming Liu, Mingqiang Geng, Kunrun Song, Huiyun Jiang, Dawei Gao, Dong Ni

Institution: Zhejiang University

Language: English

Topic: Plasma Diagnostics and Applications

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Zhejiang University

OpenAlex ID: W7170048059

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Cites: 39

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