Work

Femtosecond Laser Etching for Microelectronic Chip Fabrication: Mechanisms, Applications, and Process Integration

Year: 2026

Type: article

Source: Laser & Photonics Review

DOI: 10.1002/lpor.71549

Authors: Qing Peng, Hang Su, Zhiwei Ma, Xiangnan Pan, Gen Chen, Zeyu Huang, Hongyang Li, Jiale Li, Lihang Zheng, Linxian Li, Zishun Lu, Xintian Cai, Tangyang Pu, Zhongwei Hu, Qiang Cao, Sheng Liu

Institutions: Chinese Academy of Sciences, Wuhan University, Institute of Mechanics, State Key Laboratory of Nonlinear Mechanics, University of California, Los Angeles, Ansteel (China), Huaqiao University, Northeastern University, Hubei University of Technology

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G2760337007, G3958004537, G779307431

OpenAlex ID: W7170684734

FWCI:

Cites: 137

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